Author:
Gray W. D.,Loboda M. J.,Bremmer J. N.,Struyf H.,Lepage M.,Van Hove M.,Donaton R. A.,Sleeckx E.,Stucchi M.,Lanckmans F.,Gao T.,Boullart W.,Coenegrachts B.,Maenhoudt M.,Vanhaelemeersch S.,Meynen H.,Maex K.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. S. P Jeng, M. C. Chang, and R. H. Havemann, inAdvanced Metalization For Devices and Circuits, MRS Symposium Proceedings, Materials Research Society, p. 25 (1994).
2. S. W. Russell, A. J. McKerrow, W. Y. Shih, A. Singh, R. S. List, A. R. K. Ralston, W. W. Lee, K. J. Newton, M. C. Chang, and R. H. Havemann, inUSLI XIII, MRS Conference Proceedings, Materials Research Society, p. 289 (1998).
3. R. A. Donaton, B. Coenegrachts, K. Maex, H. Struyf, S. Vanhaelemeersch, G. Beyer, E. Richard, I. Vervoort, W. Fyen, J Grillaert, S. Van der Groen, M. Stucchi, and D. De Roest, inProceedings of the International Interconnect Technology Conference, IEEE, p. 262 (1999).
4. Electrical leakage at low-K polyimide/TEOS interface
5. L. Peters, Semicond. Int., Nov, 56 (1999).
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献