Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference518 articles.
1. Design of ion-implanted MOSFET's with very small physical dimensions
2. Moore’s crystal ball: Device physics and technology past the 15nm generation
3. Bohr M. , IEEE International Electron Devices Meeting (IEDM’95) pp. 241–244, IEEE, New York (1995).
4. Technology and reliability constrained future copper interconnects. II. Performance implications
5. Performance Modeling of Low-$k$/Cu Interconnects for 32-nm-Node and Beyond
Cited by 119 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of plasma power on growth process, chemical structure, and properties of PECVD films produced from hexamethyldisilane and ammonia;Surface and Coatings Technology;2024-08
2. Chemical, Structural, and Electrical Changes in Molecular Layer-Deposited Hafnicone Thin Films after Thermal Processing;ACS Applied Electronic Materials;2024-06-28
3. An ultra high-endurance memristor using back-end-of-line amorphous SiC;Scientific Reports;2024-06-18
4. Effect of Potassium Ferrocyanide on CMP Performance of Ruthenium in H2O2-based Slurries;ECS Journal of Solid State Science and Technology;2024-06-03
5. High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFET CMOS Logic Process;IEEE Transactions on Electron Devices;2024-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3