1. Chemical mechanical polishing of shallow trench isolation using the ceria-based high selectivity slurry for sub-0.18 μm complementary metal–oxide–semiconductor fabrication
2. http://www.agcem.com/product_cmp_ceria.html, last visited on Oct (2013)
3. http://www.hitachi-chem.co.jp/english/products/srm/022.html, last visited on Oct (2013)
4. Hosali S. D. Sethuraman A. R. Wang J.-F. Cook L. M. , U.S. Pat. 5,738,800 (1998), 6,042,741 (2000).
5. Srinivasan R. Babu S. V. America W. G. Her Y.-S. , U.S. Pat. 6,627,107 (2003), 6,544,892 (2003), 6,468,910 (2002), and 6,491,843 (2002).