Study on the Adhesion Strength of CVD-Cu Films with CVD/ALD-Co(W) Underlayers Made Using Carbonyl Precursors-Reference-Cited by-同舟云学术

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Study on the Adhesion Strength of CVD-Cu Films with CVD/ALD-Co(W) Underlayers Made Using Carbonyl Precursors

Published:2013-12-12 Issue:2 Volume:3 Page:P20-P22
ISSN:2162-8742
Container-title:ECS Solid State Letters
language:en
Short-container-title:ECS Solid State Letters

Author:

Shima K.,Shimizu H.,Momose T.,Shimogaki Y.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interconnect Processing: Integration, Dielectrics, Metals;Springer Handbook of Semiconductor Devices;2022-11-11

2. Editors' Choice—Review—Cobalt Thin Films: Trends in Processing Technologies and Emerging Applications;ECS Journal of Solid State Science and Technology;2019

3. A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization;Microelectronic Engineering;2016-08

4. Comparative Study on Cu-CVD Nucleation Using β-diketonato and Amidinato Precursors for Sub-10-nm-Thick Continuous Film Growth;ECS Journal of Solid State Science and Technology;2015

5. Study on the Adhesion Strength of CVD-Cu Films with ALD-Co(W) Underlayers Made Using Amidinato Precursors;ECS Journal of Solid State Science and Technology;2014-11-15

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