A Water Polishing Process to Improve Ceria Abrasive Removal
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference27 articles.
1. The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies
2. Wrschka P. Medd S. Green R. Feeney P. , in 2015 International Conference on Planarization/CMP Technology (ICPT), p. 1 (2015).
3. Chemical processes in glass polishing
4. Mechanism of polishing of SiO2 films by CeO2 particles
5. Almost Complete Removal of Ceria Particles Down to 10 nm Size from Silicon Dioxide Surfaces
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