1. Babu S. , Advances in Chemical Mechanical Planarization (CMP), Woodhead Publishing (2016).
2. Natarajan S. Agostinelli M. Akbar S. Bost M. Bowonder A. Chikarmane V. Chouksey S. Dasgupta A. Fischer K. Fu Q. , in Electron Devices Meeting (IEDM), 2014 IEEE International, p. 3.7. 1 (2014).
3. Yang J. C. Penigalapati D. Chao T. F. Lu W. Y. Koli D. , in Semiconductor Technology International Conference (CSTIC), 2017 China, p. 1 (2017).
4. Lee T. H. Kim H. J. Govindarajulu V. Yocum G. Mazzotti J. , in Inter. Conf. CMP/Planar. Technol (2015).
5. Post Cleaning for FEOL CMP with Silica and Ceria Slurries