Nucleation Characteristics of Directly Electrodeposited Copper on TiN-Reference-Cited by-同舟云学术

Nucleation Characteristics of Directly Electrodeposited Copper on TiN

Published:2006 Issue:9 Volume:153 Page:C673
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Kim Sunjung,Duquette David J.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Damascene copper electroplating for chip interconnections

2. R. Ravikumar, H. Cichy, R. G. Filippi, E. W. Kiewra, D. L. Rath, and G. Stojakovic , inProceedings of IITC 1999, IEEE, p. 146 (1999).

3. Dry etch challenges of 0.25 μm dual damascene structures

4. T. Licata, M. Okazaki, M. Ronay, W. Landers, H. Aochi, R. Filippi, D. Restaino, D. Knorr, and J. Ryan , inProceedings of VMIC 1995, IEEE, p. 596 (1995).

5. Copper interconnections and reliability

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