Author:
Schnabel R.F.,Dobuzinsky D.,Gambino J.,Muller K.P.,Wang F.,Perng D.C.,Palm H.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. VLSI Multilayer Interconnection Conf.;Licata,1995
2. 8th VLSI Multilayer Interconnection Conf.;Kaanta,1991
3. Fine‐Line Patterning of Parylene‐n by Reactive Ion Etching for Application as an Interlayer Dielectric
4. VLSI Multilayer Interconnection Conf.;Ueda,1995
5. International Electron Devices Meeting;Kikuta,1993
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