Author:
Di Cioccio Lea,Baudin Floriane,Gergaud Patrice,Delaye Vincent,Jouneau Pierre-Henri,Rieutord François,Signamarcheix Thomas
Abstract
Direct metal bonding represents an advanced joining technology that allows vertical stacking with electrical conduction and even heat dissipation. Direct metal bonding is performed at room temperature, under ambient air and atmospheric pressure. Thus, for most metals used as bonding layers, it involves a surface metal oxide layer. The bonding interface saddles with a trapped oxide layer. This study focuses on the analysis and modeling of metal-metal direct bonding with regards to integration stages such as annealing or layer stacking.
Publisher
The Electrochemical Society
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献