Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces-Reference-Cited by-同舟云学术

Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces

Published:2005 Issue:2 Volume:152 Page:C60
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Jezewski Christopher,Lanford W. A.,Wiegand Christopher J.,Singh J. P.,Wang Pei-I,Senkevich Jay J.,Lu Toh-Ming

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference23 articles.

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4. Atomic Layer Epitaxy of Copper on Tantalum

5. Deposition of copper films by an alternate supply of CuCl and Zn

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