A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films-Reference-Cited by-同舟云学术

A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films

Published:2020 Issue:89 Volume:56 Page:13752-13755
ISSN:1359-7345
Container-title:Chemical Communications
language:en
Short-container-title:Chem. Commun.

Author:

Boysen Nils¹²³⁴^ORCID,Misimi Bujamin⁵⁶⁷⁴,Muriqi Arbresha⁸⁹¹⁰¹¹¹²^ORCID,Wree Jan-Lucas¹²³⁴^ORCID,Hasselmann Tim⁵⁶⁷⁴,Rogalla Detlef¹³²³⁴^ORCID,Haeger Tobias⁵⁶⁷⁴,Theirich Detlef⁵⁶⁷⁴,Nolan Michael⁸⁹¹⁰¹¹¹²^ORCID,Riedl Thomas⁵⁶⁷⁴^ORCID,Devi Anjana¹²³⁴^ORCID

Affiliation:

1. Inorganic Materials Chemistry

2. Ruhr University Bochum

3. 44801 Bochum

4. Germany

5. Institute of Electronic Devices and Wuppertal Center for Smart Materials & Systems

6. University of Wuppertal

7. 42119 Wuppertal

8. Tyndall National Institute

9. University College Cork

10. Lee Maltings

11. Dyke Parade

12. Cork T12 R5CP

13. RUBION

Abstract

This is the first report on a plasma enhanced spatial atomic layer deposition (APP-ALD) process at atmospheric pressure to grow conducting metallic Cu thin films from a carbene stabilized precursor.

Funder

H2020 Marie Skłodowska-Curie Actions

Deutsche Forschungsgemeinschaft

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,General Chemistry,Ceramics and Composites,Electronic, Optical and Magnetic Materials,Catalysis

Link

http://pubs.rsc.org/en/content/articlepdf/2020/CC/D0CC05781A

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