Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material
Author:
Publisher
Polish Academy of Sciences Chancellery
Subject
Metals and Alloys
Link
https://journals.pan.pl/Content/111325/PDF/AMM-2019-2-28-Manoj%20Kumar%20Pal.pdf
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering;Journal of Materials Science: Materials in Electronics;2023-01-31
2. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Journal of Materials Science;2022-05
3. Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys;Powder Metallurgy and Metal Ceramics;2021-11
4. Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate;Intermetallics;2021-01
5. Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix;Crystal Research and Technology;2020-10-12
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