Transient Flow Boiling Heat Transfer in Water
Author:
Affiliation:
1. 神戸大学
2. 核融合科学研究所
Publisher
The Japan Institute of Marine Engineering
Subject
Religious studies,Cultural Studies
Link
https://www.jstage.jst.go.jp/article/jime/56/5/56_810/_pdf
Reference17 articles.
1. 1) N.Y.A Shammas, “Present problems of power module packaging technology,” Microelectronics Reliability, vol. 43, issue 4, pp.519-527, 2003.
2. 2) S.G. Kandlikar and C.N. Hayner II, “Liquid cooled cold plates for industrial high-power electronic devices—thermal design and manufacturing considerations,” Heat Transfer Engineering, vol. 30, issue 12, pp.918–930, 2009.
3. 3) I. Mudawar, “Two-phase microchannel heat sinks: theory, applications, and limitations,” J. Electronic Package, 133, p.41002, 2011.
4. 4) 柴原ら,日本マリンエンジニアリング学会誌,第53巻,2号,2018.
5. 5) I. Mudawar and M.B. Bowers, “Ultra-high critical heat flux (CHF) for subcooled water flow boiling-I: CHF data and parametric effects for small diameter tubes,” International Journal of Heat and Mass Transfer vol. 42, pp.1405-1428, 1999.
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