Osmotically induced increase in thermal resistance of heat-sensitive, dipicolinic acid-less spores of Bacillus cereus Ht-8

Author:

Bhothipaksa K,Busta F F

Abstract

Thermal resistance in heat-sensitive, dipicolinic acid (DPA)-less spores of Bacillus cereus Ht-8 heated in sucrose solutions increased at and above a concentration of 2 M sucrose. The decimal reduction times at 75 degrees C for spores heated in 0.0, 1.8, 2.2, and 2.6 M sucrose were 2.0, 2.8, 4.5, and 12 min, respectively. Maltose, fructose, and glucose increased heat resistance above that observed in water but did not elevate resistance to the level observed with sucrose at the same osmolality. Cation-induced loss of thermal resistance in chemically sensitized spores was reversed in the presence of sucrose. Spores germinated in brain heart infusion were resistant when heated in sucrose. In the presence of sucrose, spores exhibited an increase in optical density at 700 nm. Electron micrographs of the DPA-less spores suspended in 2.2 M sucrose revealed a shrinkage of outer coats and exosporium membranes. The results suggested that the osmotic property of sugars increased thermal resistance in DPA-less spores. The osmotic pressure exerted by sugars may be similar to the pressure that usually exists within the cortex of normal spores containing DPA and may cause the dehydration of the protoplast and the consequent thermal resistance. The role of dehydration and the nonessential nature of DPA for thermal resistance in spores were confirmed.

Publisher

American Society for Microbiology

Subject

Ecology,Applied Microbiology and Biotechnology,Food Science,Biotechnology

Reference25 articles.

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3