Photonic hybrid assembly through flexible waveguides-Reference-Cited by-同舟云学术

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Photonic hybrid assembly through flexible waveguides

Published:2016-05-13 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Wörhoff K.,Prak A.,Postma F.,Leinse A.,Wu K.,Peters T. J.,Tichem M.,Amaning-Appiah B.,Renukappa V.,Vollrath G.,Balcells-Ventura J.,Uhlig P.,Seyfried M.,Rose D.,Santos R.,Leijtens X. J. M.,Flintham B.,Wale M.,Robbins D.

Publisher

SPIE

Reference11 articles.

1. http://www.oclaro.com/technology/photonic-integration

2. Open access to technology platforms for InP-based photonic integrated circuits

3. TriPleX: a versatile dielectric photonic platform

4. www.jeppix.eu

5. Review of Packaging of Optoelectronic, Photonic, and MEMS Components

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2. Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs;Microsystem Technologies;2022-08-01

3. The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes;Applied Sciences;2022-02-25

4. Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

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