Author:
Oppermann Hermann H.,Kallmayer C.,Klein M.,Aschenbrenner R.,Reichl Herbert
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Packaging;Reference Module in Materials Science and Materials Engineering;2016
2. HgCdTe Detector Chip Technology;Technology for Advanced Focal Plane Arrays of HgCdTe and AlGaN;2016
3. Interfacial reaction between Au and Sn films electroplated for LED bumps;Journal of Materials Science: Materials in Electronics;2010-05-12
4. Packaging;Comprehensive Microsystems;2008
5. Application of SU-8 in flip chip bump micromachining for millimeter wave applications;Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)