Packaging-Reference-Cited by-同舟云学术

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Packaging

Published:2008 Issue: Volume: Page:431-463
ISSN:
Container-title:Comprehensive Microsystems
language:
Short-container-title:

Author:

Brand O.

Publisher

Elsevier

Reference108 articles.

1. Process technique for singulating fragile devices;Agarwal,2005

2. Wafer Bonding: Applications and Technology;Alexe,2004

3. Micromachined endovascularly-implanted wireless aneurysm pressure sensors: From concept to clinic;Allen,2005

4. Magnetic induction machines integrated into bulk-micromachined silicon;Arnold;IEEE J. Microelectromech. Syst.,2006

5. Fundamentals of IC assembly;Baldwin,2001

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low dead space encapsulation and integration of circuits for retinal prosthesis based on cyclic olefin copolymer;2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC);2023-07-24

2. Packaging of Biomolecular and Chemical Microsensors;Nano-Bio- Electronic, Photonic and MEMS Packaging;2021

3. Resonant MEMS Chemical Sensors;Advanced Micro and Nanosystems;2015-08-21

4. Packaging of Biomolecular and Chemical Microsensors;Nano-Bio- Electronic, Photonic and MEMS Packaging;2009-12-04

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