Interfacial reaction between Au and Sn films electroplated for LED bumps-Reference-Cited by-同舟云学术

Interfacial reaction between Au and Sn films electroplated for LED bumps

Published:2010-05-12 Issue:2 Volume:22 Page:193-199
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Huang M. L.,Liu Y.,Gao J. X.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-010-0113-z.pdf

Reference15 articles.

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3. M. Hutter, H. Oppermann, G. Engelmann, L. Dietrich, H. Reichl, in Proceedings of the 56th Electronic Components and Technology Conference (San Diego CA, 2006), p. 1087

4. J. Wei, Cryst. Res. Technol. 41, 2–150 (2006)

5. J.S. Kim, W.S. Choi, D. Kim, A. Shkel, C.C. Lee, Mater. Sci. Eng. A 458, 101 (2007)

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