Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis-Reference-Cited by-同舟云学术

Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis

Published:2019-03-26 Issue: Volume: Page:
ISSN:
Container-title:Metrology, Inspection, and Process Control for Microlithography XXXIII
language:
Short-container-title:

Author:

Le-Gratiet Bertrand,Mermet Olivier,Gardin Christian,Desmoulins Simon,Kiers Ton,Wang Yongjun,Tang Peng,Tien Hung Yu,Wang Fuming,Prentice Christopher,Tel Wim,Hunsche Stefan

Publisher

SPIE

Reference6 articles.

1. Advanced in-production hotspot prediction and monitoring with micro-topography;Fanton,2017

2. Robust 2D patterns process variability assessment using CD-SEM contour extraction offline metrology;Lakcher,2017

3. Advanced metrology by offline SEM data processing;Lakcher,2017

4. Measuring inter-layer edge placement error with SEM contours;Weisbuch,2018

5. Enabling scanning electron microscope contour-based optical proximity correction models

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Understanding the impact of rinse on SEM image distortion and hole patterning variability;38th European Mask and Lithography Conference (EMLC 2023);2023-10-05

2. Predicting DUV open contact risk with scarce sampling using new contour-based metrics;37th European Mask and Lithography Conference;2022-11-01

3. Characterization of mask CD mean-to-target for hotspot patterns by using SEM image contours and feed forward intra CDU by mask MTT;2022 International Workshop on Advanced Patterning Solutions (IWAPS);2022-10-21

4. Contour based process characterization and modeling for HVM;2022 International Workshop on Advanced Patterning Solutions (IWAPS);2022-10-21

5. Dose Control Strategy using Random Logic Device Patterns and Massive Metrology in a Foundry High Volume Manufacturing Environment;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20