Aerial imaging study of the mask-induced line-width roughness of EUV lithography masks
Author:
Affiliation:
1. Lawrence Berkeley National Lab. (United States)
Publisher
SPIE
Reference11 articles.
1. Extreme ultraviolet mask substrate surface roughness effects on lithographic patterning,;George,2010
2. Relevance of mask-roughness-induced printed line-edge roughness in recent and future extreme-ultraviolet lithography tests
3. Spatial scaling metrics of mask-induced line-edge roughness
4. Implications of image plane line-edge roughness requirements on extreme ultraviolet mask specifications,;Naulleau,2009
5. EUV Mask Line Edge Roughness,;Zweber,2012
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2. Assessing Form-Dependent Optical Scattering at Vacuum- and Extreme-Ultraviolet Wavelengths of Nanostructures with Two-Dimensional Periodicity;Physical Review Applied;2019-06-24
3. Evaluation of EUV mask impacts on wafer line-width roughness using aerial and SEM image analyses;Journal of Micro/Nanolithography, MEMS, and MOEMS;2018-09-17
4. EUV photolithography mask inspection using Fourier ptychography;Image Sensing Technologies: Materials, Devices, Systems, and Applications V;2018-05-29
5. Evaluation of EUV mask impacts on wafer line-edge roughness using aerial and SEM image analyses (Conference Presentation);Extreme Ultraviolet (EUV) Lithography IX;2018-03-27
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