Evaluation of EUV mask impacts on wafer line-edge roughness using aerial and SEM image analyses (Conference Presentation)-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Evaluation of EUV mask impacts on wafer line-edge roughness using aerial and SEM image analyses (Conference Presentation)

Published:2018-03-27 Issue: Volume: Page:
ISSN:
Container-title:Extreme Ultraviolet (EUV) Lithography IX
language:
Short-container-title:

Author:

Brunner Timothy A.,Hellweg Dirk,Dietzel Martin,Chen Xuemei,Verduijn Erik,Wood Obert R.,Capelli Renzo,Kersteen Grizelda

Publisher

SPIE

Reference10 articles.

1. EPE fundamentals and impact of EUV: will traditional ground-rule calculations work in the era of EUV?;Gabor,2018

2. Evidence of speckle in extreme-UV lithography

3. Reducing roughness in extreme ultraviolet lithography;Mack,2017

4. Modeling the transfer of line edge roughness from an EUV mask to the wafer;Gallatin,2011

5. Limitations of resist-based characterization of EUV mask surface roughness

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. AIMS EUV evolution towards high NA: challenge definition and solutions implementation;Optical and EUV Nanolithography XXXV;2022-05-26

2. High-NA EUV lithography: current status and outlook for the future;Japanese Journal of Applied Physics;2022-04-20

3. Open issues in mask technology as EUV enters high volume manufacturing;Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology;2019-06-27

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP