Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond-Reference-Cited by-同舟云学术

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Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond

Published:2002-07-15 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Hsu Stephen,Corcoran Noel P.,Eurlings Mark,Knose William T.,Laidig Thomas L.,Wampler Kurt E.,Roy Sabita,Shi Xuelong,Hsu Chungwei Michael,Chen J. Fung,Finders Jo,Socha Robert J.,Dusa Mircea V.

Publisher

SPIE

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High resolution optical lithography or high throughput electron beam lithography: The technical struggle from the micro to the nano-fabrication evolution;Microelectronic Engineering;2015-02

2. Communication theory in optical lithography;Journal of Micro/Nanolithography, MEMS, and MOEMS;2012-03-01

3. Simultaneous OPC and decomposition for double exposure lithography;SPIE Proceedings;2011-03-17

4. Double-dipole mask-synthesis using inverse lithography technology;Microelectronic Engineering;2010-04

5. An Analytic Gradient-Based Inverse Lithography Approach for Partially-Coherent Double-Exposure Lithography;Journal of Computational and Theoretical Nanoscience;2010-01-01

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