A physical resist shrinkage model for full-chip lithography simulations
Author:
Publisher
SPIE
Reference15 articles.
1. Printing the metal and contact layers for the 32- and 22-nm node: comparing positive and negative tone development process
2. Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes
3. Advanced OPC Mask-3D and Resist-3D modeling”;Szucs,2014
4. Negative tone development: gaining insight through physical simulation
5. A full-chip 3D computational lithography framework;Peng,2012
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Cluster sampling and scalable Bayesian optimization with constraints for negative tone development resist model calibration;Optics Express;2024-04-16
2. EUV OPC modeling of dry photoresist system for pitch 32nm BEOL;Optical and EUV Nanolithography XXXVII;2024-04-10
3. Layout pattern analysis and coverage evaluation in computational lithography;Optics Express;2023-02-23
4. Mask synthesis using machine learning software and hardware platforms;Optical Microlithography XXXIII;2020-03-23
5. Compact modeling of negative tone development resist with photo decomposable quencher;Optical Microlithography XXXII;2019-03-20
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3