Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning

Author:

Raley Angélique1,Lee Joe2,Smith Jeffrey T.1,Sun Xinghua1,Farrell Richard A.1,Shearer Jeffrey2,Xu Yongan2,Ko Akiteru1,Metz Andrew W.1,Biolsi Peter1,Devilliers Anton1,Arnold John2,Felix Nelson2

Affiliation:

1. Tokyo Electron Limited, Albany, New York

2. IBM Research, Semiconductor Technology Research, Albany, New York

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Review of virtual wafer process modeling and metrology for advanced technology development;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-07-12

2. Advanced process technologies for continuous logic scaling towards 2nm node and beyond (Invited);2022 IEEE International Interconnect Technology Conference (IITC);2022-06-27

3. In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization;Journal of Vacuum Science & Technology B;2022-03

4. Area-Selective Deposition: Fundamentals, Applications, and Future Outlook;Chemistry of Materials;2020-05-14

5. SAQP spacer merge and EUV self-aligned block decomposition at 28nm metal pitch on imec 7nm node;Design-Process-Technology Co-optimization for Manufacturability XIII;2019-03-20

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3