The evaluation of chipping on single-crystal silicon carbide (SiC) dicing machining using sintered diamond blades-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The evaluation of chipping on single-crystal silicon carbide (SiC) dicing machining using sintered diamond blades

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022)
language:
Short-container-title:

Author:

Wang Ping,Li Mian,Gao Lihua,Meng Hui,Mu Dekui

Publisher

SPIE

Reference13 articles.

1. Fabrication of silicon carbide microchannels by thin diamond wheel grinding

2. Grinding of additively manufactured silicon carbide surfaces for optical applications

3. Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

4. High-speed dicing of silicon wafers conducted using ultrathin blades

5. Metallic glass coating for improving diamond dicing performance;Chu;International Journal of Scientific Reports,2020

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Precision Machining by Dicing Blades: A Systematic Review;Machines;2023-02-09

2. High-Speed Dicing of SiC Wafers with 0.048 mm Diamond Blades via Rolling-Slitting;Materials;2022-11-15

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP