Affiliation:
1. School of Mechanical Engineering, Shenyang University of Technology, Shenyang 110870, China
Abstract
Diamond dicing blades are profound cutting tools that find their applications in semiconductor back-end packaging and assembly processes. To fully appreciate the benefits of the dicing blade technique for precision machining, a deeper understanding is required. This paper systematically reviews the contribution of dicing blades in machining, followed by the context of dicing blades: production, characterization, methodology, and optimization. The readers are enlightened about the potential prospects that can be exploited for precision spectra as a result of current research and engineering developments.
Funder
National Natural Science Foundation of China
Liaoning Revitalization Talents Program, China
Natural Science Foundation of Liaoning Province, China
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Optimization,Mechanical Engineering,Computer Science (miscellaneous),Control and Systems Engineering
Reference114 articles.
1. Investigation of the cutting performance of laser dressed metal bonded diamond blades;Stompe;Intl. Cong. App.L. Elect.Opt.,2013
2. Laser-dressing topography and quality of resin-bonded diamond grinding wheels;Deng;Opt. Lasers Eng.,2021
3. Precision electrochemical machining of tungsten micro-rods using wire electrochemical turning method;Han;Int. J. Adv. Manuf. Technol.,2020
4. The optimal cutting times of multipass abrasive water jet cutting;Miao;Int. J. Adv. Manuf. Technol.,2018
5. Mizuno, M., Iyama, T., and Zhang, B. (2008). Analysis of the sawing process with abrasive circular saw blades. J. Manuf. Sci. Technol., 130.
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