Study of mask and wafer co-design that utilizes a new extreme SIMD approach to computing in memory manufacturing: full-chip curvilinear ILT in a day-Reference-Cited by-同舟云学术

Study of mask and wafer co-design that utilizes a new extreme SIMD approach to computing in memory manufacturing: full-chip curvilinear ILT in a day

Published:2019-10-03 Issue: Volume: Page:
ISSN:
Container-title:Photomask Technology 2019
language:
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Author:

Pang Linyong,Russell Ezequiel V.,Baggenstoss Bill,Lee Michael,Digaum Jennefir,Yang Ming-Chuan,Ungar P. Jeffrey,Bouaricha Ali,Wang Kechang,Su Bo,Pearman Ryan,Fujimura Aki

Publisher

SPIE

Reference20 articles.

1. Reduction Of Errors Of Microphotographic Reproductions By Optimal Corrections Of Original Masks

2. Image construction through diffraction-limited high-contrast imaging systems: an iterative approach

3. Optimal binary image design for optical lithography;Liu,1990

4. Binary and phase-shifting image design for optical lithography;Liu,1991

5. Optimum mask and source patterns to print a given shape;Rosenbluth;JM3,2002

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