A study of reactive adhesion promoters and their ability to mitigate pattern collapse in thin film lithography-Reference-Cited by-同舟云学术

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A study of reactive adhesion promoters and their ability to mitigate pattern collapse in thin film lithography

Published:2011-03-17 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Yeh Wei-Ming,Lawson Richard A.,Tolbert Laren M.,Henderson Clifford L.

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer;Journal of Micro/Nanolithography, MEMS, and MOEMS;2017-08-28

4. Pattern collapse solution for asymmetric pattern;SPIE Proceedings;2017-03-27

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