1. Metal oxide EUV photoresist performance for N7 relevant patterns and processes;Stowers,2016
2. Polymer Engineering & Science
3. New high‐resolution charge transfer x‐ray and electron beam negative resist
4. Development of materials and processes for double patterning toward 32-nm node 193-nm immersion lithography process;Tarutani,2008
5. Moreau, Wayne M., Semiconductor Lithography: Principles, Practices, and Materials, Plenum Press, New York, 199 (1988).