Holistic approach for overlay and edge placement error to meet the 5nm technology node requirements-Reference-Cited by-同舟云学术

Holistic approach for overlay and edge placement error to meet the 5nm technology node requirements

Published:2018-03-13 Issue: Volume: Page:
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Container-title:Metrology, Inspection, and Process Control for Microlithography XXXII
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Author:

Mulkens Jan,Kubis Michael,Tel Wim,Maslow Mark,Ma Eric,Chou Kevin,Liu Xuedong,Ren Weiming,Hu Xuerang,Wang Fei,Liu Kevin,Slachter Bram,Dillen Harm,Hinnen Paul

Publisher

SPIE

Reference13 articles.

1. Advanced patterning techniques: Etch opportunities and responsibilities;Schenker,2016

2. Patterning Control Strategies for Minimum Edge Placement Error;Mulkens,2017

3. SAQP and EUV block patterning of BEOL metal layers on IMEC’s iN7 platform;Bekaert,2017

4. Overlay and Edge Placement Control Strategies for the 7-nm node using EUV and ArF lithography;Mulkens,2015

5. Efficient hybrid metrology for focus, CD, and overlay;Tel,2017

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