Optimized lithography process for through-silicon vias-fabrication using a double-sided (structured) photomask for mask aligner lithography-Reference-Cited by-同舟云学术

Optimized lithography process for through-silicon vias-fabrication using a double-sided (structured) photomask for mask aligner lithography

Published:2015-08-13 Issue:3 Volume:14 Page:034501
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Weichelt Tina¹,Stuerzebecher Lorenz¹,Zeitner Uwe D.²

Affiliation:

1. Friedrich-Schiller-Universität, Institute of Applied Physics, Abbe Center of Photonics, Albert-Einstein-Street 15, Jena 07745, Germany

2. Friedrich-Schiller-Universität, Institute of Applied Physics, Abbe Center of Photonics, Albert-Einstein-Street 15, Jena 07745, GermanybFraunhofer Institute for Applied Optics and Precision Engineering, Albert-Einstein-Street 7, Jena 07745, Germany

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Precise and simple optical alignment method for double-sided lithography

2. Precise alignment through thick wafers using an optical copying technique

3. Advanced mask aligner lithography: new illumination system

4. Advanced mask aligner lithography (AMALITH)

5. Resolution enhancement for advanced mask aligner lithography using phase-shifting photomasks

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mask aligner lithography using laser illumination for versatile pattern generation;Optics Express;2017-08-21

2. Advanced photomask fabrication by e-beam lithography for mask aligner applications;32nd European Mask and Lithography Conference;2016-10-20