Laser technology for wafer dicing and microvia drilling for next generation wafers (Invited Paper)
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SPIE
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire;Materials Science in Semiconductor Processing;2021-11
2. Through-substrate vias based three-dimensional interconnection technology;Handbook of Silicon Based MEMS Materials and Technologies;2020
3. TSV-Based 3-D ICs: Design Methods and Tools;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2017-10
4. Study of die break strength and heat-affected zone for laser processing of thin silicon wafers;Journal of Laser Applications;2015-08
5. Via Technologies for MEMS;Handbook of Silicon Based MEMS Materials and Technologies;2015
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