Mask process correction validation for multi-beam mask lithography-Reference-Cited by-同舟云学术

Mask process correction validation for multi-beam mask lithography

Published:2018-11-12 Issue: Volume: Page:
ISSN:
Container-title:Photomask Technology 2018
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Author:

Bork Ingo,Buck Peter,Durvasula Bhardwaj,Eder-Kapl Stefan,Hudek Peter,Platzgummer Elmar,Nageswara Rao,Reddy Murali,Spengler Christoph,Klikovits Jan,Rankin Jed H.,Bürgel Christian,Jurkovic Michal

Publisher

SPIE

Reference8 articles.

1. Mask model calibration for MPC applications utilizing shot dose assignment;Bork;Photomask Technology,2014

2. Using rule-based shot dose assignment in model-based MPC applications;Bork;Photomask Technology,2014

3. A fully model-based MPC solution including VSB shot dose assignment and shape correction;Bork;Photomask Technology,2015

4. MBMW-101: World’s 1st high-throughput multi-beam mask writer;Klein;Photomask Technology,2016

5. Elmar Platzgummer, et al., “Electron multi-beam technology for mask and wafer writing at 0.1 nm address grid”, Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), Vol. 12(3), (Jul-Sep 2013)

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