Improving on-product performance at litho using integrated diffraction-based metrology and computationally designed device-like targets fit for advanced technologies (incl. FinFET)

Author:

Chen Kai-Hsiung,Huang GT,Chen KS,Hsieh C. W.,Chen YC,Ke CM,Gau TS,Ku YC,Bhattacharyya Kaustuve,Huang Jacky,den Boef Arie,v. d. Schaar Maurits,Maassen Martijn,Plug Reinder,Zhang Youping,Meyer Steffen,van Veen Martijn,de Ruiter Chris,Wu Jon,Xu Hua,Chow Tatung,Chen Charlie,Verhoeven Eric,Li Pu,Hinnen Paul,Storms Greet,Pao Kelvin,Zhang Gary,Fouquet Christophe,Mori Takuya

Publisher

SPIE

Reference12 articles.

1. Integrated scatterometry for tight overlay and CD control to enable 20-nm node wafer manufacturing;Benschop,2013

2. On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections;Bhattacharyya,2013

3. High-order field-to-field corrections to achieve sub-20nm lithography requirements;Mulkens,2013

4. Advanced Litho-Cluster Control Via Integrated In-Chip Metrology;Bhattacharyya,2013

5. Evaluation of a novel ultra small target technology supporting on-product overlay measurements;Smilde,2012

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