Rigorous wafer topography simulation for investigating wafer alignment quality and robustness-Reference-Cited by-同舟云学术

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Rigorous wafer topography simulation for investigating wafer alignment quality and robustness

Published:2015-03-26 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Morgana Nicoló,Gavrilin Dmitrii,Greiner Andreas,Hofmann Detlef,Kamohara Itaru,Klostermann Ulrich,Moeller Holger,Preuninger Juergen

Publisher

SPIE

Reference20 articles.

1. Effects of Alignment Accuracy on CMP Process for Overlay Control;Hong,2000

2. Segmented Alignment Mark Optimization and Signal Strength Enhancement for Deep Trench Process;Cui,2004

3. Modeling of Alignment Schemes in Commercial Steppers;Yuan,1990

4. Laser Alignment Modeling Using Rigorous Numerical Simulations;Wojcik,1991

5. Ultra-fast Wafer Alignment Simulation Based on Thin Film Theory;Wu,2002

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of diffraction-based wafer alignment rejection for thick aluminum process;Journal of Vacuum Science & Technology B;2022-03

2. Sub-pixel position estimation algorithm based on Gaussian fitting and sampling theorem interpolation for wafer alignment;Applied Optics;2021-10-21

3. Measurement algorithm for wafer alignment based on principal component analysis;Applied Optics;2021-06-24

4. Calibration Method for Alignment Error Caused by Asymmetric Deformation of Mark and Its Application in Overlay Measurement;Chinese Journal of Lasers;2019

5. Calibration method of overlay measurement error caused by asymmetric mark;Applied Optics;2018-11-19

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