Measurement algorithm for wafer alignment based on principal component analysis-Reference-Cited by-同舟云学术

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Measurement algorithm for wafer alignment based on principal component analysis

Published:2021-06-24 Issue:19 Volume:60 Page:5569
ISSN:1559-128X
Container-title:Applied Optics
language:en
Short-container-title:Appl. Opt.

Author:

Shu Ting,Wang Shaoqing,Xu Jinghao,Fan Lili,Yuan Fenghua,Pan Songyong,Dai Fengzhao,Bu Yang,Wang Xiangzhao

Funder

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering

Reference25 articles.

1. ArF step-and-scan system with 0.75 NA for the 0.10μm node

2. Imaging application tools for extremely low-k1 ArF immersion lithography

3. New criterion about the topography of W-CMP wafer's alignment mark

4. Advanced alignment optical system for DUV scanner

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simple visual focusing and alignment technology for digital lithography;Optics and Lasers in Engineering;2024-10

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