Line edge roughness frequency analysis for SAQP process
Author:
Publisher
SPIE
Reference4 articles.
1. Application of frequency domain line edge roughness characterization methodology in lithography
2. Line edge roughness frequency analysis during pattern transfer in semiconductor fabrication
3. Comparison of Left and Right Side Line Edge Roughness in Lithography;Sun,2016
4. Systematic studies on reactive ion etch-induced deformations of organic underlayers
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1. A Study of Image Contrast, Stochastic Defectivity, and Optical Proximity Effect in EUV Photolithographic Process Under Typical 5 nm Logic Design Rules;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26
2. Analysis of Linewidth Uniformity and Line Edge/Width Roughness in a 5 nm Logic SAQP Process;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26
3. Line edge roughness metrology: recent challenges and advances toward more complete and accurate measurements;Journal of Micro/Nanolithography, MEMS, and MOEMS;2018-10-13
4. Introduction of pre-etch deposition techniques in EUV patterning;Advanced Etch Technology for Nanopatterning VII;2018-04-09
5. Line edge roughness reduction for 7nm metals;Optical Microlithography XXXI;2018-03-20
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