Advanced surface affinity control for DSA contact hole shrink applications-Reference-Cited by-同舟云学术

Advanced surface affinity control for DSA contact hole shrink applications

Published:2017-03-21 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Delachat Florian¹,Gharbi Ahmed¹,Pimenta Barros Patricia¹,Argoud Maxime¹,Lapeyre Céline¹,Bos Sandra¹,Hazart Jérôme¹,Pain Laurent¹,Monget Cédric²,Chevalier Xavier³,Nicolet Célia³,Navarro Christophe³,Cayrefourcq Ian³,Tiron Raluca¹

Affiliation:

1. CEA-LETI (France)

2. STMicroelectronics (France)

3. Arkema S.A. (France)

Publisher

SPIE

Reference25 articles.

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4. The potential of block copolymer’s directed self-assembly for contact hole shrink and contact multiplication

5. “Integration of block copolymer directed assembly with 193 immersion lithography.”, J. Vac. Sci. Technol. B Nanotechnol. Microelectron. Mater. Process. Meas. Phenom. 28(6), C6B30–C6B34 (2010).

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3. An embedded neutral layer for advanced surface affinity control in grapho-epitaxy directed self-assembly;Nanoscale;2018