Demonstrating production quality multiple exposure patterning aware routing for the 10NM node

Author:

Liebmann Lars,Gerousis Vassilios,Gutwin Paul,Zhang Mike,Han Geng,Cline Brian

Publisher

SPIE

Reference7 articles.

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Tilted ion implantation of spin-coated SiARC films for sub-lithographic and two-dimensional patterning;Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019;2019-03-26

2. Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning;Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019;2019-03-26

3. The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD;Novel Patterning Technologies 2018;2018-03-28

4. Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2018-03

5. Triple Patterning Aware Detailed Placement Toward Zero Cross-Row Middle-of-Line Conflict;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2017-07

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