High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features-Reference-Cited by-同舟云学术

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High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features

Published:2020-05-12 Issue:02 Volume:19 Page:1
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Sun Wei¹,Ohta Hiroya²,Ninomiya Taku²,Goto Yasunori²

Affiliation:

1. Hitachi, Ltd., Research & Development Group, Tokyo

2. Hitachi High-Tech Corporation, Ibaraki

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancements in metrology for advanced semiconductor packaging;Optics and Photonics for Advanced Dimensional Metrology III;2024-06-18

2. Coming of Age in Computational SEM;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

3. Nano-mapping of vertical contact electrodes using synchrotron scanning photoelectron microscopy;Applied Surface Science;2024-05

4. High throughput CD-SEM metrology using image denoising based on deep learning;Metrology, Inspection, and Process Control XXXVIII;2024-04-10

5. AI-enhanced optical critical dimension metrology for high aspect ratio structures in semiconductor advanced packaging;Novel Patterning Technologies 2024;2024-04-09

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