RIE challenges for sub-15 nm line-and-space patterning using directed self-assembly lithography with coordinated line epitaxy (COOL) process-Reference-Cited by-同舟云学术

RIE challenges for sub-15 nm line-and-space patterning using directed self-assembly lithography with coordinated line epitaxy (COOL) process

Published:2015-03-17 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Kasahara Y.,Seino Y.,Kobayashi K.,Kanai H.,Sato H.,Kubota H.,Tobana T.,Minegishi S.,Miyagi K.,Kihara N.,Kodera K.,Shiraishi M.,Kawamonzen Y.,Nomura S.,Azuma T.

Publisher

SPIE

Reference16 articles.

1. Simple and Versatile Methods To Integrate Directed Self-Assembly with Optical Lithography Using a Polarity-Switched Photoresist

2. Towards electrical testable SOI devices using Directed Self-Assembly for fin formation;Liu,2014

3. Defect reduction and defect stability in IMEC’s 14nm half-pitch chemo-epitaxy DSA flow;Gronheid,2014

4. The SMARTTM Process for Directed Block Co-Polymer Self-Assembly

5. A novel simple sub-15nm line-and-space patterning process flow using directed self-assembly technology

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1. Characterization of half-pitch 15-nm metal wire circuit fabricated by directed self-assembly of polystyrene-block-poly(methyl methacrylate);Microelectronic Engineering;2016-06

2. Calculations of the free energy of dislocation defects in lamellae forming diblock copolymers using thermodynamic integration;Journal of Micro/Nanolithography, MEMS, and MOEMS;2016-05-10

3. Reactive ion etching challenges for half-pitch sub-10-nm line-and-space pattern fabrication using directed self-assembly lithography;SPIE Proceedings;2016-03-23

4. Fabrication of Sub-10 nm Metal Wire Circuits using Directed Self-Assembly of Block Copolymers;Journal of Photopolymer Science and Technology;2016

5. Simulation study on defect annihilation dynamics in directed self-assembly lithography;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2015-11