Advanced in-line optical metrology of sub-10nm structures for gate all around devices (GAA)
Author:
Affiliation:
1. IBM Research (United States)
2. Nova Measuring Instruments, Inc. (United States)
3. Nova Measuring Instruments, LTD (Israel)
4. ReVera (United States)
Publisher
SPIE
Reference3 articles.
1. I. Lauer et al., “Si nanowire CMOS fabricated with minimal deviation from RMG FinFET technology showing record performance,” VLSI Technology (VLSI Technology), 2015 Symposium on, Kyoto, 2015, pp. T140-T141; doi: 10.1109/VLSIT.2015.7223653
2. Benoit L'Herron, Robin Chao, Kwanghoon Kim, Wei Ti Lee, Koichi Motoyama, et al., “Hybridization of XRF/XPS and scatterometry for Cu CMP process control”, Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241M (March 19, 2015); doi:10.1117/12.2086155.
3. Benoit L'Herron, Nicolas Loubet, Qing Liu, et. al., “Silicon-Germanium (SiGe) Composition and Thickness Determination via Simultaneous Small-spot XPS and XRF Measurements”, Proc. Advanced Semiconductor Manufacturing Conference (ASMC), Saratoga Springs, New York, May 19-21, 2014.
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