Improving full-wafer on-product overlay using computationally designed process-robust and device-like metrology targets-Reference-Cited by-同舟云学术

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Improving full-wafer on-product overlay using computationally designed process-robust and device-like metrology targets

Published:2015-03-19 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Kim Young-Sik,Hwang Young-Sun,Jung Mi-Rim,Yoo Ji-Hwan,Kwon Won-Taik,Ryan Kevin,Tuffy Paul,Zhang Youping,Park Sean,Oh Nang-Lyeom,Park Chris,Shahrjerdy Mir,Werkman Roy,Sun Kyu-Tae,Byun Jin-Moo

Publisher

SPIE

Reference1 articles.

1. Improving on-product performance at litho using integrated diffraction-based metrology and computationally designed device-like targets fit for advanced technologies (incl. FinFET);Chen,2014

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 光刻对准关键技术的发展与挑战;Acta Optica Sinica;2023

2. Improving accuracy and sensitivity of diffraction-based overlay metrology;Chinese Optics Letters;2023

3. Improving the cross-layer misalignment measurement accuracy by pattern-center shift induced error calibration;Optics and Lasers in Engineering;2022-08

4. Grating Interferometer with Redundant Design for Performing Wide-Range Displacement Measurements;Sensors;2022-05-14

5. Optimized wavelength selection for diffraction-based overlay measurement by minimum asymmetry factor variation with finite-difference time-domain simulation;Applied Optics;2022-02-11

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