The SEMATECH Berkeley microfield exposure tool: learning at the 22-nm node and beyond-Reference-Cited by-同舟云学术

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The SEMATECH Berkeley microfield exposure tool: learning at the 22-nm node and beyond

Published:2009-03-13 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Alternative Lithographic Technologies
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Author:

Naulleau Patrick P.,Anderson Christopher N.,Baclea-an Lorie-Mae,Denham Paul,George Simi,Goldberg Kenneth A.,Goldstein Michael,Hoef Brian,Hudyma Russ,Jones Gideon,Koh Chawon,La Fontaine Bruno,McClinton Brittany,Miyakawa Ryan,Montgomery Warren,Roller John,Wallow Thomas,Wurm Stefan

Publisher

SPIE

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Deposition of Mo/Si multilayers onto MEMS micromirrors and its utilization for extreme ultraviolet maskless lithography;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2017-11

2. EUV processing and characterization for BEOL;SPIE Proceedings;2015-03-13

3. Study of ion implantation into EUV resist for LWR improvement;SPIE Proceedings;2011-03-17

4. An Evaluation of Ion Implantation for LWR Improvement in EUV Lithography;Journal of Photopolymer Science and Technology;2011

5. Residual speckle in a lithographic illumination system;Journal of Micro/Nanolithography, MEMS, and MOEMS;2009-10-01

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