Wafer-bonded semiconductors using In/Sn and Cu/Ti metallic interlayers
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1738933
Reference10 articles.
1. Optoelectronic-VLSI: photonics integrated with VLSI circuits
2. Vertical and lateral heterogeneous integration
3. Fabrication of a Cylindrical Display by Patterned Assembly
4. Low‐resistance Ohmic conduction across compound semiconductor wafer‐bonded interfaces
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