Agglomeration and Dendritic Growth of Cu/Ti/Si Thin Film

Author:

Lin Qi-jing1,Jing Weixuan1,Yang Shu-ming12,Jiang Zhuang-de1,Wang Chen-ying1

Affiliation:

1. State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China

2. State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, China

Abstract

Agglomeration and the transformation from random fractal to dendritic growth have been observed during Cu/Ti/Si thin film annealing. The experimental results show that the annealing temperature, film thickness, and substrate thickness influenced the agglomeration and dendritic growth. Multifractal spectrum is used to characterize the surface morphology quantificationally. The shapes of the multifractal spectra are hook-like to the left. Value ofΔαincreases with the annealing temperature rising, andΔfincreases from 500°C to 700°C but reduces from 700°C to 800°C. The dendritic patterns with symmetrical branches are generated in the surfaces when the thin films were annealed at 800°C.

Funder

National Natural Science Foundation of China

Publisher

Hindawi Limited

Subject

General Materials Science

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