FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING-Reference-Cited by-同舟云学术

FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING

Published:2018-07 Issue:05 Volume:25 Page:1850097
ISSN:0218-625X
Container-title:Surface Review and Letters
language:en
Short-container-title:Surf. Rev. Lett.

Author:

LIN QIJING¹²³⁴,JING WEIXUAN²,JIANG ZHUANGDE¹²,ZHAO NA²,WU ZIRONG²,WANG CHENYING¹²,YANG SHUMING²

Affiliation:

1. Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China

2. State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China

3. State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, P. R. China

4. State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hanzhou 310027, P. R. China

Abstract

Sandwich stacked Ti/Cu/Si thin films were deposited on a single-side polished Si(111) substrate using DC magnetron sputtering system and annealed using a rapid thermal annealing (RTA) system. Complex dendritic patterns, whose branches are composed of Cu rods and triangular Cu microcrystals were obtained on Ti/Cu thin film annealed at 700[Formula: see text]C. The shape of one triangular Cu microcrystal is a truncated equilateral triangular pyramid with a flat top. Triangular Cu microcrystals grow in the number when Ti/Cu thin films are annealed at 800[Formula: see text]C. Experimental results show that anisotropy affects the growth of surface patterns and the top Ti capping layer works as a protection for the underlying Cu layer from oxidation.

Funder

National Natural Science Foundation of China

973 Program

The Fundamental Research Funds for the Central Universities

The fund of the State Key Lab of Digital Manufacturing Equipment & Technology

Huazhong University of Science and Technology), Open Foundation of the State Key Laboratory of Fluid Power and Mechatronic Systems

111 Program

China Postdoctoral Science Foundation

Publisher

World Scientific Pub Co Pte Lt

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics