Electrical characterization of epitaxial silicon films formed by a low kinetic energy particle process
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.100981
Reference7 articles.
1. High‐rate growth at low temperatures by free‐jet molecular flow: Surface‐reaction film‐formation technology
2. Nonequilibrium boron doping effects in low‐temperature epitaxial silicon films
3. Low Temperature Silicon Epitaxy by Partially Ionized Vapor Deposition
4. Crystalline and Electrical Characteristics of Silicon Films Deposited by Ionized-Cluster-Beams
5. Room‐temperature copper metallization for ultralarge‐scale integrated circuits by a low kinetic‐energy particle process
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2. Electrical characteristics of p–n junction diodes fabricated by Si epitaxy at low temperature using sputtering-type electron cyclotron resonance plasma;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2001
3. Epitaxial Si(001) grown at 80–750 °C by ion‐beam sputter deposition: Crystal growth, doping, and electronic properties;Journal of Applied Physics;1996-07-15
4. Ultra-clean processing for ULSI;Microelectronics Journal;1995-09
5. Formation of giant-grain copper interconnects by a low-energy ion bombardment process for high-speed ULSIs;Materials Chemistry and Physics;1995-08
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