Author:
Takewaki T.,Yamada H.,Shibata T.,Ohmi T.,Nitta T.
Subject
Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Accelerated-Deposition Rate and High-Quality Film Copper Chemical Vapor Deposition Using a Water Vapor Addition to a Hydrogen and Cu(HFA)2Reaction System
2. Tech. Digest, Symp. VLSI Technology, Seattle, WA, USA;Cho,1991
3. Plasma-Enhanced Chemical Vapor Deposition of Copper
4. Tech. Digest, 1992 Int. Electron Device Meet., San Francisco, CA, USA;Cho,1992
5. Tech. Digest, 1993 Int. Electron Device Meet., Washington, DC, USA;Cho,1993
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献