XRD and EBSD analysis of Cu film on randomly oriented ZrN x film as the underlying materials
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
https://iopscience.iop.org/article/10.35848/1347-4065/ab7f57/pdf
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1. Microstructure and reliability of copper interconnects
2. Formation of giant-grain copper interconnects by a low-energy ion bombardment process for high-speed ULSIs
3. Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
4. Thinned wafer multi-stack 3DI technology
5. Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
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